Latest market study on "Hermetic Packaging Market to 2027 by Product (Passivation Glass, Transponder Glass, Reed Glass, Glass-to-Metal Sealing, Ceramic-to-Metal Sealing); Application (Transistors, MEMS, Sensors, Lasers, Photo Diodes, Airbag Ignitors, Others); Industry Vertical (Aerospace, Medical, Telecommunications, Consumer Electronics, Military and Defense, Automotive, Others); – Global Analysis and Forecast", the hermetic packaging market is estimated to reach US$ 6.19 Bn by 2027 from US$ 3.51 Bn in 2018. The report includes a key understanding of the driving factors of this growth and also highlights the prominent players in the market and their developments.
Airtight bundling gives dependable security to delicate electronic parts against different ecological circumstances like barometrical strain, soil, dampness, and other normal risks. These variables could seriously influence the working of electrical associations and harm the sensitive gadgets utilized in different enterprises. Airtight bundling is made of materials like glass and earthenware production that offer long coherence life to electronic parts and made them safe. With expanding mechanical progressions in different enterprises, the tension of elite execution is driving makers to enhance and deliver hardware that could support in cruel ecological circumstances.
In the auto business, airtight bundling are utilized to safeguard sensors that are utilized in airbag gear and rollover gadgets. In the clinical business, hermetics are utilized in pacemakers, hearing gadgets, RFID transponder gadgets, and other implantable clinical gadgets. In the media communications industry, airtight bundling is utilized to safeguard sensitive electronic hardware in telecom foundation. Thus, enterprises like auto, clinical and media communications, where gadgets parts are put through outrageous circumstances like high/low temperature and tension, are driving the interest of airtight bundled part during the conjecture time of 2019 to 2027.
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The global aerospace and defense industry is experiencing a strong growth owing to factors such as growing passenger travel demand and increasing military expenditure in countries such as China and the US. With rising geopolitical tensions in various regions, the aerospace and defense industry is expected to continue its growth trajectory during the forecast period of 2019 to 2027. With the growing demand for application-specific customized solutions and high safety and reliability requirements, aerospace and defense industry provides a positive demand outlook for hermetically packaged electronic components. Various companies such as SCHOTT AG and AMETEK, Inc. offers hermetic packages for safeguarding sensitive electronic components used in the aerospace and defense industry. Hence, factors such as increasing commercial and military aircraft production and rising spending on defense/military equipment are anticipated to drive the demand of hermetically protected electronic components in the global aerospace and defense industry.
Further, based on industry vertical, Aerospace segment led the market with the maximum market share. Key players operating in the market are partnering with the small as well as large hermetic packaging manufacturers and other companies which are helping them to gain customer traction. The major companies offering hermetic packaging market include Ametek, Inc., Egide SA, Kyocera Corporation, Legacy Technologies Inc., Materion Corporation, Micross Components, Renesas Electronics Corporation, Schott AG, Teledyne Technologies Incorporated, and Texas Instruments Inc. among others. Several other companies are also offering these hermetic packaging for various end-uses, which is facilitating the market to propel over the years.
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