Wet chemicals play an important role in the manufacturing of electronics and semiconductor devices. They are liquid chemical formulations that are precisely designed for carrying out various cleaning, etching and deposition processes during semiconductor wafer fabrication. Whether it is removing contaminants, patterning layers or depositing new materials, wet chemicals form the backbone of many lithography and material processing steps. In this article, we will look at some commonly used wet chemicals, their functions and applications in the semiconductor industry.

Cleaning Chemicals

The removal of Wet Chemicals for Electronics and Semiconductor Application and other contaminants from wafer surfaces is essential before commencing any microfabrication process. Cleaning chemicals help achieve this by dissolving, suspending or reacting with unwanted residuals. Some of the most widely used cleaning chemicals include:

- SC1 Solution: Standard Clean 1 solution is an aqueous mixture of ammonium hydroxide, hydrogen peroxide and water. It is primarily used for stripping native oxide layers and removing organic contaminants through oxidation.

- SC2 Solution: Standard Clean 2 solution consists of hydrogen chloride, hydrogen peroxide and water. It finds application in dissolving and lifting off inorganic contaminants like metals via chelation.

- RCA Clean: A combination of SC1 and SC2 cleaning in sequence, this two-step process is capable of providing particle-free hydrophilic surfaces critical for high-yield fabrication.

- Solvents: Organic solvents like acetone, isopropanol etc. are employed for rinsing and drying wafers after aqueous cleaning. They help displace water from surfaces.

Etching Chemicals

Etching is the controlled removal of material layers using wet or dry methods. Wet etching relies on specially formulated chemical baths for anisotropically etching silicon, dielectrics and metals. Some prominent wet etching chemicals include:

- Hydrofluoric Acid: A dilute hydrofluoric acid solution provides an isotropic and selective etch for silicon dioxide and silicon. It finds widespread application in shallow trench isolation and contact hole patterning.

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